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AMD's new Ryzen 9 7950X3D CPU is now here! 3D V-Cache is AWESOME!

AMD's new Ryzen 9 7950X3D CPU is now here! 3D V-Cache is AWESOME!
Allied
Mar 02, 2023

Ryzen 9 7950X3D CPU Launched! Configure Your Beast New Gaming PC Today 💪 🍟 🖥️

AMD's latest and greatest Ryzen CPUs have launched and are now in-house here at Allied, with the new flagship Ryzen 9 7950X3D processor ready for AM5 motherboards: perfect for enthusiast gamers, content creators, and anyone else wanting second-gen 3D V-Cache and up to 16 cores and 32 threads of CPU power.
 
The new AMD Ryzen 9 7950X3D has been designed for gamers, with the stack of additional cache memory slapped on top of the existing processor die. This cache is connected to the die using through-silicon vias (TSVs) that are vertically interconnected through to the silicon substrate. What does this mean? AMD can add a huge chunk of L3 cache memory to the CPU, all without a separate, larger CCD next to the CPU. It's kinda like magic, and very cool to see deployed into consumer CPUs.
 
Both the current Ryzen 9 7950X and the new Ryzen 9 7950X3D feature 16 cores and 32 threads of CPU power that boost up to 5.7GHz (while the non-3D V-Cache cores will boost up to 4.7GHz or so) but the big difference here is the L3 cache. The 7950X has just 64MB of L3 cache, while the new 7950X3D boasts 128MB of L3 cache in total. Not only that, but the 7950X has a TDP of 170W and PPT of up to 230W, while the new 7950X3D has a TDP of 120W and a PPT of just 162W in comparison.

AMD has put some interesting design work into the Ryzen 7000X3D series CPUs, where they've used two CCDs (core complex dies) with one of them featuring AMD 3D V-Cache for the ultimate in latency reduction, while next to it is a standard CCX which is the perfect solution for high-frequency performance. AMD is using an asymmetric chiplet design here, with one of the Zen 4 CCDs featuring 64MB of V-Cache stacked on, while the other is a regular Zen 4 CCD with 32MB of L3 cache. In between, there's AMD's in-house Infinity Fabric Interconnect that connects both of the CCDs to a centralized IOD in a die-to-die connect flow.






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